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| (R) VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT HIGH SIDE DRIVER TYPE VN820 VN820SP VN820-B5 VN820SO VN820PT RDS(on) IOUT VCC 10 40 m 9A 36 V 1 PowerSO-10TM P2PAK PPAK CMOS COMPATIBLE INPUT ON STATE OPEN LOAD DETECTION s OFF STATE OPEN LOAD DETECTION s SHORTED LOAD PROTECTION s UNDERVOLTAGE AND OVERVOLTAGE SHUTDOWN s PROTECTION AGAINST LOSS OF GROUND s VERY LOW STAND-BY CURRENT s s s PENTAWATT PACKAGE PENTAWATT TUBE SO-16L T&R ORDER CODES VN820 VN820SP VN820-B5 VN820SO VN820PT VN820SP13TR VN820-B513TR VN820SO13TR VN820PT13TR REVERSE BATTERY PROTECTION (*) PowerSO-10TM P2PAK SO-16L PPAK DESCRIPTION The VN820, VN820SP, VN820-B5, VN820SO, VN820PT are monolithic devices made by using STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground. Active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient BLOCK DIAGRAM compatibility table). Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device detects open load condition both is on and off state. Output shorted to VCC is detected in the off state. Device automatically turns off in case of ground pin disconnection. VCC VCC CLAMP OVERVOLTAGE DETECTION UNDERVOLTAGE DETECTION GND Power CLAMP INPUT LOGIC DRIVER OUTPUT CURRENT LIMITER STATUS ON STATE OPENLOAD DETECTION OVERTEMPERATURE DETECTION OFF STATE OPENLOAD AND OUTPUT SHORTED TO V CC DETECTION (*) See application schematic at page 9 Rev. 1 1/35 July 2004 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT ABSOLUTE MAXIMUM RATING Symbol VCC - VCC - IGND IOUT - IOUT IIN ISTAT Parameter DC Supply Voltage Reverse DC Supply Voltage DC Reverse Ground Pin Current DC Output Current Reverse DC Output Current DC Input Current DC Status Current Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) VESD - INPUT - STATUS - OUTPUT - VCC Maximum Switching Energy (L=4mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Maximum Switching Energy (L=3.7mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Maximum Switching Energy (L=4.48mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Power Dissipation TC=25C Junction Operating Temperature Case Operating Temperature Storage Temperature 4000 4000 5000 5000 481 481 438 526 65.8 65.8 65.8 Internally Limited - 40 to 150 - 55 to 150 8.3 65.8 V V V V mJ mJ mJ W C C C Value Unit PowerSO-10TM PENTAWATT P2PAK SO-16L PPAK 41 V - 0.3 V - 200 mA Internally Limited A -9 A +/- 10 mA +/- 10 mA EMAX EMAX EMAX Ptot Tj Tc Tstg CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C. PINS GROUND INPUT ST TUS A N.C. N.C. 6 7 8 9 10 11 5 4 3 2 1 OUTPUT OUTPUT N.C. OUTPUT OUTPUT VCC N.C. GND INPUT STATUS N.C. N.C. VCC 1 16 VCC OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT VCC PowerSO-10TM PPAK / P2PAK / PENTAWATT N.C. X X Output X Input X Through 10K resistor Connection / Pin Status Floating X To Ground 8 9 VCC SO-16L CURRENT AND VOLTAGE CONVENTIONS IS VF IIN INPUT ISTAT STATUS VCC IOUT OUTPUT GND VCC VIN VSTAT IGND VOUT 2/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT THERMAL DATA Symbol Rthj-case Rthj-lead Rthj-amb Rthj-amb (1) (2) Parameter Thermal Resistance Junction-case Thermal Resistance Junction-lead Thermal Resistance Junction-ambient Thermal Resistance Junction-ambient Max Max Max Max Value PowerSO-10 PENTAWATT P2PAK SO-16L PPAK 1.9 1.9 1.9 1.9 15 (1) (1) (1) 65 (2) 76.9 (1) 51.9 61.9 51.9 37 (3) 37 (3) 48 (4) 45 (3) Unit C/W C/W C/W C/W When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). When mounted on FR4 printed circuit board with 0.5cm2 of Cu (at least 35 thick) connected to all VCC pins. (3) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35m thick). (4) When mounted on FR4 printed circuit board with 6cm2 of Cu (at least 35 thick) connected to all V CC pins. ELECTRICAL CHARACTERISTICS (8V IS Supply Current Tj=25C On State; VCC=13V; VIN=5V; IOUT=0A IL(off1) IL(off2) IL(off3) IL(off4) Off Off Off Off State State State State Output Current Output Current Output Current Output Current VIN=VOUT=0V VIN=0V; VOUT =3.5V VIN=VOUT=0V; Vcc=13V; Tj =125C VIN=VOUT=0V; Vcc=13V; Tj =25C SWITCHING (V CC=13V) Symbol td(on) td(off) Parameter Turn-on Delay Time Turn-off Delay Time Test Conditions RL=4.3 from VIN rising edge to VOUT =1.3V RL=4.3 from VIN falling edge to VOUT =11.7V RL=4.3 from VOUT =1.3 to VOUT =10.4V RL=4.3 from VOUT =11.7 to VOUT =1.3V Min Typ 30 30 See relative diagram See relative diagram Max Unit s s V/s dVOUT/dt(on) Turn-on Voltage Slope dVOUT/dt(off) Turn-off Voltage Slope V/s 3/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT ELECTRICAL CHARACTERISTICS (continued) INPUT PIN Symbol VIL IIL VIH IIH VI(hyst) VICL Parameter Input Low Level Low Level Input Current Input High Level High Level Input Current Input Hysteresis Voltage Input Clamp Voltage Test Conditions VIN=1.25V VIN=3.25V IIN=1mA IIN=-1mA 0.5 6 6.8 -0.7 Min 1 3.25 10 8 Typ Max 1.25 Unit V A V A V V V VCC - OUTPUT DIODE Symbol VF Parameter Forward on Voltage Test Conditions -IOUT=2A; Tj=150C Min Typ Max 0.6 Unit V STATUS PIN Symbol VSTAT ILSTAT CSTAT VSCL Parameter Test Conditions Status Low Output Voltage ISTAT =1.6mA Status Leakage Current Normal Operation VSTAT=5V Status Pin Input Normal Operation VSTAT=5V Capacitance ISTAT =1mA Status Clamp Voltage ISTAT =-1mA Min Typ Max 0.5 10 100 6 6.8 -0.7 8 Unit V A pF V V PROTECTIONS (see note 1) Symbol TTSD TR Thyst tSDL Ilim Vdemag Parameter Shut-down Temperature Reset Temperature Thermal Hysteresis Status delay in overload condition Current limitation Turn-off Output Clamp Voltage Test Conditions Min 150 135 7 Typ 175 15 20 9 5.5V Note 1: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles OPENLOAD DETECTION Symbol IOL tDOL(on) Parameter Openload ON State Detection Threshold Openload ON State Detection Delay Openload OFF State Voltage Detection Threshold Openload Detection Delay at Turn Off Test Conditions VIN=5V IOUT =0A Min 70 Typ 150 Max 300 200 Unit mA s VOL tDOL(off) VIN=0V 1.5 2.5 3.5 V s 1000 4/35 2 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT OPEN LOAD STATUS TIMING (with external pull-up) VOUT > VOL VIN IOUT< I OL OVERTEMP STATUS TIMING Tj > TTSD VIN VSTAT VSTAT tDOL(off) tDOL(on) tSDL tSDL SWITCHING TIME WAVEFORMS VOUT 90% 80% dVOUT/dt(on) dVOUT/dt(off) 10% t VIN td(on) td(off) t TRUTH TABLE CONDITIONS Normal Operation Current Limitation Overtemperature Undervoltage Overvoltage Output Voltage > VOL Output Current < IOL INPUT L H L H H L H L H L H L H L H OUTPUT L H L X X L L L L L L H H L H STATUS H H H (Tj < TTSD) H (Tj > TTSD) L H L X X H H L H H L 5/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT OPEN LOAD DETECTION IN OFF STATE Off state open load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 1) no false open load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT=(VPU/(RL+RPU))RL V batt. VPU VCC RPU INPUT DRIVER + LOGIC OUT + R STATUS VOL RL IL(off2) GROUND 6/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT ELECTRICAL TRANSIENT REQUIREMENTS ON VCC PIN ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 CLASS C E TEST LEVELS III -75 V +75 V -100 V +75 V -6 V +66.5 V TEST LEVELS RESULTS II III C C C C C C C C C C E E I -25 V +25 V -25 V +25 V -4 V +26.5 V II -50 V +50 V -50 V +50 V -5 V +46.5 V IV -100 V +100 V -150 V +100 V -7 V +86.5 V Delays and Impedance 2 ms 10 0.2 ms 10 0.1 s 50 0.1 s 50 100 ms, 0.01 400 ms, 2 I C C C C C C IV C C C C C E CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. 7/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT Figure 1: Waveforms NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDERVOLTAGE VCC VUSD INPUT LOAD VOLTAGE STATUS undefined VUSDhyst OVERVOLTAGE VCC OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS Tj INPUT LOAD CURRENT STATUS TTSD TR OVERTEMPERATURE 8/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT APPLICATION SCHEMATIC +5V +5V Rprot STATUS VCC Dld C Rprot INPUT OUTPUT GND VGND RGND DGND GND PROTECTION REVERSE BATTERY NETWORK AGAINST Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / (IS(on)max). 2) RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device's datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected. LOAD DUMP PROTECTION Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds VCC max DC rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table. C I/Os PROTECTION: If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k. 9/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT Off State Output Current IL(off1) (A) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 High Level Input Current Iih (uA) 5 Off state Vcc=36V Vin=Vout=0V 4.5 Vin=3.25V 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Input Clamp Voltage Vicl (V) 8 7.8 Input High Level Vih (V) 3.6 3.4 3.2 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 3 2.8 2.6 2.4 6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 2.2 2 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Input Low Level Vil (V) 2.6 2.4 2.2 Input Hysteresis Voltage Vhyst (V) 1.5 1.4 1.3 1.2 2 1.8 1.6 1.4 1.1 1 0.9 0.8 0.7 1.2 1 -50 -25 0 25 50 75 100 125 150 175 0.6 0.5 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) 10/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT Overvoltage Shutdown Vov (V) 50 48 46 44 42 40 38 36 34 32 30 -50 -25 0 25 50 75 100 125 150 175 ILIM Vs Tcase Ilim (A) 25 22.5 Vcc=13V 20 17.5 15 12.5 10 7.5 5 2.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Turn-on Voltage Slope dVout/dt(on) (V/ms) 1000 900 800 700 600 500 400 300 200 100 0 -50 -25 0 25 50 75 100 125 150 175 Turn-off Voltage Slope dVout/dt(off) (V/ms) 1000 900 Vcc=13V Rl=4.3Ohm 800 700 600 500 400 300 200 100 0 -50 Vcc=13V Rl=4.3Ohm -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) On State Resistance Vs Tcase Ron (mOhm) 100 90 80 70 60 50 40 30 20 10 0 -50 -25 0 25 50 75 100 125 150 175 On State Resistance Vs V CC Ron (mOhm) 100 90 Iout=3A Vcc=8V; 13V; 36V 80 Tc= 150C 70 60 50 40 30 20 10 0 5 10 15 20 25 30 35 40 Tc= 25C Tc= - 40C Tc (C) Vcc (V) 11/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT Status Clamp Voltage Vscl (V) 8 7.8 Status Leakage Current Ilstat (uA) 0.05 Istat=1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 0 -50 -25 0 25 50 75 100 125 150 175 0.01 0.02 0.03 0.04 Vstat=5V Tc (C) Tc (C) Status Low Output Voltage Vstat (V) 0.8 0.7 Open Load Off State Voltage Detection Threshold Vol (V) 5 4.5 Istat=1.6mA 0.6 Vin=0V 4 3.5 0.5 0.4 0.3 0.2 3 2.5 2 1.5 1 0.1 0 -50 -25 0 25 50 75 100 125 150 175 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Open Load On State Detection Threshold Iol (mA) 200 190 180 170 160 150 140 130 120 110 100 90 80 -50 -25 0 25 50 75 100 125 150 175 Vcc=13V Vin=5V Tc (C) 12/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PowerSO-10, P 2PAK, PENTAWATT Maximum turn off current versus load inductance ILMAX (A) 100 10 A B C 1 0.1 1 L(mH ) A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: VCC=13.5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization 10 100 t 13/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PPAK Maximum turn off current versus load inductance ILMAX (A) 100 A 10 B C 1 0.1 1 L(mH) A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: VCC=13.5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization 10 100 t 14/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT SO-16L Maximum turn off current versus load inductance ILM AX (A) 100 A B 10 C 1 0.1 1 L(mH) A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: VCC=13.5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization 10 100 t 15/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT SO-16L THERMAL DATA SO-16L PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.5cm2, 6cm2). Rthj-amb Vs PCB copper area in open box free air condition 70 65 60 55 50 45 40 RTH j-amb (C/W) 0 1 2 3 4 5 6 7 PCB Cu heatsink area (cm^2) 16/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT P2PAK THERMAL DATA P2PAK PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.97cm2, 8cm2). Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 17/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PPAK THERMAL DATA PPAK PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.44cm2, 8cm2). Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (C/W) 90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 18/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PowerSO-10TM THERMAL DATA PowerSO-10TM PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2). Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 19/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PowerSO-10 Thermal Impedance Junction Ambient Single Pulse ZTH (C/W) 100 0.5 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 10 100 1000 Time (s) Thermal fitting model of a single channel HSD in PowerSO-10 Pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T 0.5 0.04 0.25 0.25 0.8 12 37 0.0008 7.00E-03 0.015 0.3 0.75 3 6 Thermal Parameter Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd 22 T_amb 5 20/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT P2PAK Thermal Impedance Junction Ambient Single Pulse ZTH (C/W) 1000 100 0.97 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 T ime (s) 10 100 1000 Thermal fitting model of a single channel HSD in P 2PAK Pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T 0.97 0.04 0.25 0.3 4 9 37 0.0008 0.007 0.015 0.4 2 3 6 Thermal Parameter Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd 22 T_amb 5 21/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PPAK Thermal Impedance Junction Ambient Single Pulse ZT H (C/W) 1000 100 0.44 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Thermal fitting model of a single channel HSD in PPAK Pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T 0.44 0.04 0.25 0.3 2 15 61 0.0008 0.007 0.02 0.3 0.45 0.8 6 Thermal Parameter Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd 24 T_amb 5 22/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT SO-16L Thermal Impedance Junction Ambient Single Pulse ZT H (C/W) 1000 100 0.5 cm2 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 T ime (s) 10 100 1000 Thermal fitting model of a single channel HSD in SO-16L Pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T 0.5 0.04 0.25 2.2 12 15 37 0.0008 7.00E-03 1.50E-02 0.14 1 3 6 Thermal Parameter Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) Tj C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Pd 22 T_amb 5 23/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PowerSO-10TM MECHANICAL DATA DIM. A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) (*) (*) Muar only POA P013P mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232 inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8 B 0.10 A B 10 H E E2 E E4 1 SEATING PLANE e 0.25 B DETAIL "A" A C D = D1 = = = SEATING PLANE h A F A1 A1 L DETAIL "A" P095A 24/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PENTAWATT (VERTICAL) MECHANICAL DATA DIM. A C D D1 E F F1 G G1 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Diam. 3.65 2.6 15.1 6 4.5 4 3.85 0.144 10.05 17.85 15.75 21.4 22.5 3 15.8 6.6 0.102 0.594 0.236 0.177 0.157 0.152 2.4 1.2 0.35 0.8 1 3.2 6.6 3.4 6.8 mm. MIN. TYP MAX. 4.8 1.37 2.8 1.35 0.55 1.05 1.4 3.6 7 10.4 10.4 0.396 0.703 0.620 0.843 0.886 0.118 0.622 0.260 0.094 0.047 0.014 0.031 0.039 0.126 0.260 0.134 0.268 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.041 0.055 0.142 0.276 0.409 0.409 25/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT P2PAK MECHANICAL DATA DIM. A A1 A2 b c c2 D D2 E E1 e e1 L L2 L3 L5 R V2 Package Weight 0 1.40 Gr (typ) 3.20 6.60 13.70 1.25 0.90 1.55 0.40 8 10.00 8.50 3.60 7.00 14.50 1.40 1.70 2.40 mm. MIN. 4.30 2.40 0.03 0.80 0.45 1.17 8.95 8.00 10.40 TYP MAX. 4.80 2.80 0.23 1.05 0.60 1.37 9.35 P010R 26/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT SO-16L MECHANICAL DATA DIM. A a1 a2 b b1 C c1 D E e e3 F L M S 7.4 0.5 10.1 10.0 1.27 8.89 7.6 1.27 0.75 8 (max.) 0.291 0.020 10.5 10.65 0.35 0.23 0.5 45 (typ.) 0.397 0.393 0.050 0.350 0.300 0.050 0.029 0.413 0.419 0.1 mm. MIN. TYP MAX. 2.65 0.2 2.45 0.49 0.32 0.014 0.009 0.020 0.004 MIN. inch TYP. MAX. 0.104 0.008 0.096 0.019 0.012 27/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PPAK MECHANICAL DATA DIM. A A1 A2 B B2 C C2 D1 D E E1 e G G1 H L2 L4 R V2 Package Weight 0 Gr. 0.3 0.60 0.2 8 4.90 2.38 9.35 0.8 6.00 6.40 4.7 1.27 5.25 2.70 10.10 1.00 1.00 MIN. 2.20 0.90 0.03 0.40 5.20 0.45 0.48 5.1 6.20 6.60 TYP MAX. 2.40 1.10 0.23 0.60 5.40 0.60 0.60 P032T1 28/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PowerSO-10TM SUGGESTED PAD LAYOUT 14.6 - 14.9 B TUBE SHIPMENT (no suffix) CASABLANCA MUAR C 10.8 - 11 6.30 A A C 0.67 - 0.73 1 2 3 4 5 10 9 8 7 6 0.54 - 0.6 B 9.5 All dimensions are in mm. 1.27 Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 0.8 0.8 10.4 16.4 4.9 17.2 TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2 End All dimensions are in mm. Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components 29/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PENTAWATT TUBE SHIPMENT (no suffix) B C Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) All dimensions are in mm. 50 1000 532 18 33.1 1 A 30/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT P2PAK TUBE SHIPMENT (no suffix) B C Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) All dimensions are in mm. 50 1000 532 18 33.1 1 A TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 16 1.5 1.5 11.5 6.5 2 End All dimensions are in mm. Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components 31/35 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT SO-16L TUBE SHIPMENT (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) All dimensions are in mm. A C B 50 1000 532 3.5 13.8 0.6 TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 12 1.5 1.5 7.5 6.5 2 End All dimensions are in mm. Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components 32/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT PPAK TUBE SHIPMENT (no suffix) A C B Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) All dimensions are in mm. 75 3000 532 6 21.3 0.6 TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 8 1.5 1.5 7.5 6.5 2 End All dimensions are in mm. Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components 33/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT REVISION HISTORY Date Revision - Minor changes - Current and voltage convention update (page 2). - "Configuration diagram (top view) & suggested connections for unused and n.c. pins" insertion (page 2). Jul 2004 1 - 6 cm2 Cu condition insertion in Thermal Data table (page 3). - VCC - OUTPUT DIODE section update (page 4). - PROTECTIONS note insertion (page 3) - Revision History table insertion (page 34). - Disclaimers update (page 35). Description of Changes 34/35 1 VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - Printed in ITALY- All Rights Reserved. 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